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Research Project: Packaging of micro mechanical resonant sensors

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1996

Spiering, V.L. and Bergveld, P. and Elwenspoek, M.C. and van den Berg, A. (1996) A µsensor array in a fluidic system for space applications. In: Proceedings Dutch Sensor Conference, 20-21 March 1996, Delft, Netherlands. pp. 143-146. Delft University Press. ISBN 90-407-1321-9

Spiering, V.L. and Lammerink, T.S.J. and Jansen, H.V. and Fluitman, J.H.J. and van den Berg, A. (1996) Technologies and microstructures for separation techniques in chemical analysis. In: Proceedings of SPIE - The International Society for Optical Engineering - Micromachined Devices and Components II, 14-15 Oct 1996, Austin, TX, USA. pp. 91-100. SPIE, The International Society for Optical Engineering. ISSN 0277-786X

1995

Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. (1995) Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back. Journal of micromechanics and microengineering, 5 (2). pp. 189-192. ISSN 0960-1317 *** ISI Impact 2,276 ***

Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. and Fluitman, J.H.J. (1995) Sacrificial wafer bonding for planarization after very deep etching. Journal of microelectromechanical systems, 4 (3). pp. 151-157. ISSN 1057-7157 *** ISI Impact 2,157 ***

1994

Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. and Fluitman, J.H.J. (1994) Low temperature sacrificial wafer bonding for planarization after very deep etching. In: Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS), 25-28 Jan 1994, Oiso, Jpn. pp. 69-74. IEEE Computer Society. ISBN 0-7803-1833-1

1993

Spiering, V.L. and Bouwstra, S. and Burger, J.F. and Elwenspoek, M.C. (1993) Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief. Journal of micromechanics and microengineering, 3 (4). pp. 243-246. ISSN 0960-1317 *** ISI Impact 2,276 ***

Spiering, V.L. and Bouwstra, S. and Fluitman, J.H.J. (1993) Realization of mechanical decoupling zones for package-stress reduction. Sensors and actuators A: Physical, 37-38. pp. 800-804. ISSN 0924-4247 *** ISI Impact 1,933 ***

1991

Spiering, V.L. and Bouwstra, S. and Spiering, R.M.E.J. and Elwenspoek, M.C. (1991) On-chip decoupling zone for package-stress reduction. In: 1991 International Conference on Solid-State Sensors and Actuators - Transducers '91, 24-28 June 1991, San Francisco, CA, USA. pp. 982-985. IEEE Computer Society. ISBN 0-87942-585-7