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Research Project: Microcooling
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2010

Mogulkoc, B. and Jansen, H.V. and ter Brake, H.J.M. and Elwenspoek, M.C. (2010) Incorporation of in-plane electrical internonnects to the reflow bonding. In: 21st Micromechanics and Micro systems Europe workshop (MME2010), 26-29 Sept 2010, Enschede. pp. 1-4. Universiteit Twente - TST. ISBN 978-90-81673716

2009

Mogulkoc, B. and Jansen, H.V. and Berenschot, J.W. and ter Brake, H.J.M. and Knowles, K.M. and Elwenspoek, M.C. (2009) Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substrates. Journal of micromechanics and microengineering, 19 (085027). pp. 1-10. ISSN 0960-1317 *** ISI Impact 1,768 ***
Unnikrishnan, S. and Jansen, H.V. and Berenschot, J.W. and Mogulkoc, B. and Elwenspoek, M.C. (2009) Microfluidics within a Swagelok®: A MEMS-on-tube assembly. In: 22nd IEEE International Conference on Micro Electro Mechanical Systems, 25-29 January 2009, Sorrento, Italy. pp. 1-4. Technical Digest. ISSN 1084-6999

2006

Lerou, P.P.P.M. and Vanapalli, S. and Jansen, H.V. and Burger, J.F. and Veenstra, T.T. and Venhorst, G.C.F. and Holland, H.J. and Elwenspoek, M.C. and ter Brake, H.J.M. and Rogalla, H. (2006) Microcooling Developments at the University of Twente. In: Advances in cryogenic engineering: transactions of the cryogenic engineering. AIP Conference Proceedings 823. American Institute of Physics, Maryland, pp. 1-8. ISSN 0094-243X ISBN 9780735403178

1999

Burger, J.F. and Van der Wekken, M.C. and Berenschot, J.W. and Holland, H.J. and ter Brake, H.J.M. and Rogalla, H. and Gardeniers, J.G.E. and Elwenspoek, M.C. (1999) High pressure check valve for application in a miniature cryogenic sorption cooler. In: Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS), 17-21 Jan 1999, Orlando, FL, USA. pp. 183-188. IEEE Computer Society. ISBN 0-7803-5194-0

1998

Burger, J.F. and Berenschot, J.W. and Burger, G.J. and Visscher, H. and Elwenspoek, M.C. (1998) Piezoresistive friction force sensor for tribological research. Journal of micromechanics and microengineering, 8 (2). pp. 138-140. ISSN 0960-1317 *** ISI Impact 1,768 ***