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EEMCS EPrints Service


Editor: Tsujimura, M.
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Number of items: 1.

2003

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) A reliability model for interlayer dielectric cracking during fast thermal cycling. In: Advanced Metallization Conference (AMC 2003), 21-23 Oct 2003, Montreal, Canada. pp. 295-299. Materials Research Society. ISBN 1558997571

This list was generated on Mon Mar 27 08:33:39 CEST 2017.