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Number of items: 1. 2003
Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G.
(2003)
A reliability model for interlayer dielectric cracking during fast thermal cycling.
In: Advanced Metallization Conference (AMC 2003), 21-23 Oct 2003, Montreal, Canada.
pp. 295-299.
Materials Research Society.
ISBN 1558997571
This list was generated on Thu May 24 08:14:58 CEST 2012. |
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