EEMCS EPrints Service
|
||||||||||||||||
2003
Nguyen, Viet Hoang and Daamen, R. and van Kranenburg, H. and van der Velden, P. and Woerlee, P.H.
(2003)
A physical model for dishing during metal CMP.
Journal of the Electrochemical Society, 150 (11).
G689-G693.
ISSN 0013-4651
*** ISI Impact 2,420 ***
2001
Nguyen, Viet Hoang and Hof, A.J. and van Kranenburg, H. and Woerlee, P.H. and Weimar, F.
(2001)
Copper chemical mechanical polishing using a slurry-free technique.
Microelectronic engineering, 55 (1-4).
pp. 305-312.
ISSN 0167-9317
*** ISI Impact 1,569 ***
|
||||||||||||||||