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Author: Kuper, F.G.
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2010

van Dijk, K. and Volf, P. and Detcheverry, C. and Yau, A. and Ngan, P. and Liang, Z. and Kuper, F.G. (2010) Validating foundry technologies for extended mission profiles. In: Proceedings of IEEE International Reliability Physics Symposium 2010 (IRPS), 2-6 May 2010, Anaheim, CA, USA. pp. 111-116. IEEE Computer Society. ISBN 978-1-4244-5430-3
Li, Yuan and Donnet, D. and Grzegorczyk, A. and Cavelaars, J. and Kuper, F.G. (2010) Assessing the degradation mechanisms and current limitation design rules of SICR-based thin-film resistors in integrated circuits. In: Proceedings of the IEEE International Reliability Physics Symposium 2010 (IRPS), 2-6 May 2010, Anaheim, CA, USA. pp. 724-730. IEEE Computer Society. ISBN 978-1-4244-5430-3

2009

Wali, F. and Knotter, D.M. and Mud, A. and Kuper, F.G. (2009) Impact of particles in ultra pure water on random yield loss in IC production. Microelectronic engineering, 86 (2). pp. 140-144. ISSN 0167-9317 *** ISI Impact 1,569 ***

2008

Kuper, F.G. (2008) Automotive IC reliability: Elements of the battle towards zero defects. Microelectronics reliability, 48 (8-9). pp. 1459-1463. ISSN 0026-2714 *** ISI Impact 1,066 ***
Sasse, G.T. and Acar, M. and Kuper, F.G. and Schmitz, J. (2008) RF CMOS reliability simulations. Microelectronics reliability, 48 (8-9). pp. 1581-1585. ISSN 0026-2714 *** ISI Impact 1,066 ***
Sasse, G.T. and Kuper, F.G. and Schmitz, J. (2008) MOSFET Degradation Under RF Stress. IEEE transactions on electron devices, 55 (11). pp. 3167-3174. ISSN 0018-9383 *** ISI Impact 2,255 ***
Wali, F. and Knotter, D.M. and Kuper, F.G. (2008) Liquid-borne nano particles impact on the random yield during critical processes in IC’s production. In: Proceedings of the 11th annual workshop on semiconductor advances for future electronics and sensors (SAFE 2008), 27-28 Nov 2008, Veldhoven, The Netherlands. pp. 513-515. Technology Foundation STW. ISBN 978-90-73461-56-7
Wali, F. and Knotter, D.M. and Kuper, F.G. (2008) Impact of nano particles on semiconductor manufacturing. In: Proceedings of 12th IEEE International Multitopic Conference (INMIC) 2008, 23-24 Dec 2008, Karachi. pp. 97-99. IEEE. ISBN 978-1-4244-2823-6

2006

Kuper, F.G. and Fan, X.J. (2006) Reliability practice. In: Mechanics of Microelectronics. Solid Mechanics and Its Applications 141. Springer Verlag, London, pp. 35-63. ISBN 978-1-4020-4934-7
Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2006) Current Degradation of a-Si:H/SiN TFTs at Room Temperature and Low Voltages. IEEE Transactions on Electron Devices, 53 (9). pp. 2273-2279. ISSN 0018-9383 *** ISI Impact 2,255 ***
Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2006) Determination of the contribution of defect creation and charge trapping to the degradation of a-Si:H/SiN TFTs at room temperature and low voltages. Journal of Non-Crystalline Solids, 352 (36-37). pp. 3849-3853. ISSN 0022-3093 *** ISI Impact 1,483 ***
Salm, C. and Hof, A.J. and Kuper, F.G. and Schmitz, J. (2006) Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs. Microelectronics reliability, 46 (9-11). pp. 1617-1622. ISSN 0026-2714 *** ISI Impact 1,066 ***
Wali, F. and Martin Knotter, D. and Kelly, J.J. and Kuper, F.G. (2006) Deposition and detection of particles during integrated circuit manufacturing. In: Proceedings of the 9th annual workshop on Semiconductor Advances for Future Electronics and Sensors 2006, 23-24 Nov 2006, Veldhoven, The Netherlands. pp. 483-487. Technology Foundation STW. ISBN 90-73461-44-8

2005

Sowariraj, M.S.B. and de Jong, P.C. and Salm, C. and Mouthaan, A.J. and Kuper, F.G. (2005) A 3-D circuit model to evaluate CDM performance of Ics. Microelectronics Reliability, 45 (9-11). pp. 1425-1429. ISSN 0026-2714 *** ISI Impact 1,066 ***
Sowariraj, M.S.B. and de Jong, P.C. and Salm, C. and Smedes, T. and Mouthaan, A.J. and Kuper, F.G. (2005) Significance of including substrate capacitance in the full chip circuit model of ICs under CDM stress. In: 43rd Annual IEEE International Reliability Physics Symposium, 2005, 17-21 April 2005, San Jose, California, USA. pp. 608-609. IEEE Computer Society. ISBN 0780388038
Wang, Zhichun and Ackaert, J.G.G. and Scarpa, A. and Salm, C. and Kuper, F.G. and Vugts, M. (2005) Strategies to cope with plasma charging damage in design and layout phases. In: IEEE International Conference in Integrated Circuit and Technology (ICICDT), 9-11 May 2005, Austin, Texas, USA. pp. 91-98. IEEE Computer Society. ISBN 0780390814

2004

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Fast thermal cycling-enhanced electromigration in power metallization. IEEE Transactions on Device and Materials Reliability, 4 (2). pp. 246-255. ISSN 1530-4388 *** ISI Impact 1,483 ***
Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of thermal gradients on the electromigration lifetime in power electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 Apr 2004, Phoenix, Arizona, USA. pp. 619-620. IEEE Computer Society. ISSN 1082-7285 ISBN 078038315X
Tao, G. and Scarpa, A. and van Marwijk, L. and van Dijk, K. and Kuper, F.G. (2004) Applying the fWLR concept to Stress induced leakage current in non-volatile memory processes. Microelectronics reliability, 44 (8). pp. 1269-1273. ISSN 0026-2714 *** ISI Impact 1,066 ***
Wang, Zhichun and Ackaert, J.G.G. and Salm, C. and Kuper, F.G. and de Backer, E. (2004) Plasma charging damage reduction in IC processing by a self-balancing interconnect. Microelectronics Reliability, 44 (9-11). pp. 1503-1507. ISSN 0026-2714 *** ISI Impact 1,066 ***
Wang, Zhichun and Ackaert, J.G.G. and Salm, C. and Kuper, F.G. and Tack, M. and de Backer, E. and Coppens, P. and de Schepper, L. and Vlachakis, B. (2004) Plasma-charging damage of floating MIM capacitors. IEEE transactions on electron devices, 51 (6). pp. 1017-1024. ISSN 0018-9383 *** ISI Impact 2,255 ***

2003

Li, Yuan and Veenstra, K.J. and Dubois, J. and Peters-Wu, L. and van Zomeren, A.A. and Kuper, F.G. (2003) Reservoir effect and maximum allowed VIA misalignment for AICu interconnect with tungsten VIA plug. Microelectronics Reliability, 43 (9-11). pp. 1449-1454. ISSN 0026-2714 *** ISI Impact 1,066 ***
Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2003) Progressive degradation in a-Si: H/SiN thin film transistors. Thin Solid Films, 427 (1-2). 60-66. ISSN 0040-6090 *** ISI Impact 1,909 ***
Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) Electrothermomigration-induced failure in power IC metallization. In: Proceedings of the 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands. pp. 622-630. Technology Foundation STW. ISBN 90-73461-39-1
Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) A reliability model for interlayer dielectric cracking during fast thermal cycling. In: Advanced Metallization Conference (AMC 2003), 21-23 Oct 2003, Montreal, Canada. pp. 295-299. Materials Research Society. ISBN 1558997571
Sowariraj, M.S.B. and Smedes, T. and Salm, C. and Mouthaan, A.J. and Kuper, F.G. (2003) Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels - An explantion and die protection strategy. Microelectronics Reliability, 43 (9-11). pp. 1569-1575. ISSN 0026-2714 *** ISI Impact 1,066 ***
Sowariraj, M.S.B. and Smedes, T. and Salm, C. and Mouthaan, A.J. and Kuper, F.G. (2003) Study on the influence of package parasitics and substrate resistance on the Charged Device Model(CDM) failure levels - possible protection methodology. In: Proceedings of the 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2003, 25 - 26 November 2003, Veldhoven, The Netherlands. pp. 657-662. Technology Foundation STW. ISBN 90-73461-39-1
Tao, G. and Scarpa, A. and van Dijk, K. and Kuper, F.G. (2003) Process qualification strategy for advances embedded non volatile memory technology - the Philips'0.18um embedded flash case. In: International Reliability Physics Symposium IRPS 2003, 30 March - 4 April 2003, Dallas, Texas, USA. pp. 604-605. IEEE Computer Society. ISBN 0780376498
Wang, Zhichun and Ackaert, J.G.G. and Salm, C. and Kuper, F.G. and Bessemans, K. and de Backer, E. (2003) "Plasma charging damage induced by a power ramp down step in the end of plasma enhanced chemical vapour deposition (PECVD) process. In: Proceedings of the 6th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2003, 25 - 26 November 2003, Veldhoven, The Netherlands. pp. 766-770. Technology Foundation STW. ISBN 90-73461-39-1

2002

Golo-Tosic, N. and Kuper, F.G. and Mouthaan, A.J. (2002) Analysis of the electrical breakdown in hydrogenated amorphous silicon thin-film transistors. IEEE transactions on electron devices, 49 (6). pp. 1012-1018. ISSN 0018-9383 *** ISI Impact 2,255 ***
Golo-Tosic, N. and Kuper, F.G. and Mouthaan, A.J. (2002) Zapping thin film transistors. Microelectronics Reliability, 42 (4). pp. 747-765. ISSN 0026-2714 *** ISI Impact 1,066 ***
Golo-Tosic, N. and van der Wal, S. and Kuper, F.G. and Mouthaan, A.J. (2002) Estimation of the impact of electrostatic discharge on density of states in hydrogenated amorphous silicon thin-film transistors. Applied Physics Letters, 80 (18). pp. 3337-3339. ISSN 0003-6951 *** ISI Impact 3,820 ***
Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling and electromigration induced thin film cracking multilevel interconnection: experiments and modeling. Microelectronics Reliability, 42 (9-11). pp. 1415-1420. ISSN 0026-2714 *** ISI Impact 1,066 ***
Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands. pp. 69-74. Technology Foundation STW. ISBN 90-73461-33-2
Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Test chip for detecting thin film cracking induced by fast temperature cycling and electromigration in multilevel interconnect systems. In: 9th International Symposium on Physics and Failure Analysis 2002, 8-12 Jul 2002, Singapore, Thailand. pp. 135-139. IEEE Computer Society. ISBN 0780374169
Nguyen, Van Hieu and Salm, C. and Wenzel, R. and Mouthaan, A.J. and Kuper, F.G. (2002) Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectronics Reliability, 42 (9-11). pp. 1421-1425. ISSN 0026-2714 *** ISI Impact 1,066 ***
Sowariraj, M.S.B. and Kuper, F.G. and Salm, C. and Mouthaan, A.J. and Smedes, T. (2002) Impact of layout and technology variation on the CDM performance of ggNMOSTs and SCRs. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands. pp. 104-107. Technology Foundation STW. ISBN 90-73461-33-2
Sowariraj, M.S.B. and Salm, C. and Mouthaan, A.J. and Smedes, T. and Kuper, F.G. (2002) The influence of technology variation on ggNMOSTs and SCRs against CDM ESD stress. Microelectronics Reliability, 42 (9-11). pp. 1287-1292. ISSN 0026-2714 *** ISI Impact 1,066 ***
Wang, Zhichun and Scarpa, A. and Smits, S.M. and Kuper, F.G. and Salm, C. (2002) Temperature effect on protection diode for plasma-process induced charging damage. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands. pp. 127-130. Technology Foundation STW. ISBN 90-73461-33-2
Wang, Zhichun and Scarpa, A. and Smits, S.M. and Salm, C. and Kuper, F.G. (2002) Temperature effect on antenna protection strategy for plasma-process induced charging damage. In: 7th International symposium of Plasma Process-Induced Damage, 6-7 June 2002, Maui, Hawaii, USA. pp. 134-137. IEEE Computer Society. ISBN 0965157776

2001

Golo-Tosic, N. and van der Wal, S. and Kuper, F.G. and Mouthaan, A.J. (2001) The time-voltage trade-off for ESD damage threshold in amorphous silicon hydrogenated thin film transistors. Microelectronics Reliability, 41 (9-10). pp. 1391-1396. ISSN 0026-2714 *** ISI Impact 1,066 ***
Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2001) Study of dynamics of charge trapping in a-Si:H/SiN TFTs. In: Proceedings of the 4th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2001, 29-30 Nov 2001, Veldhoven, The Netherlands. pp. 109-114. Technology Foundation STW. ISBN 90-73461-29-4
Nguyen, Van Hieu and Salm, C. and Mouthaan, A.J. and Kuper, F.G. (2001) Modeling of the reservoir effect on electromigration lifetime. In: 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits, 9-13 Jul 2001, Singapore, Thailand. pp. 169-173. IEEE Computer Society. ISBN 0-7803-6675-1
Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2001) Fast thermal cycling stress and degredation in multilayer interconnects. In: Proceedings of 4th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2001, 28-30 Nov 2001, Veldhoven, The Netherlands. pp. 136-140. Technology Foundation STW. ISBN 90-73461-29-4
Salm, C. and Houtsma, V.E. and Kuper, F.G. and Woerlee, P.H. (2001) Temperature acceleration of thin gate-oxide degradation. In: Proceedings of the 4th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2001, 28-30 Nov 2001, Veldhoven, The Netherlands. pp. 174-177. Technology Foundation STW. ISBN 90-73461-29-4
Wang, Zhichun and Ackaert, J.G.G. and Salm, C. and Kuper, F.G. (2001) Charging induced damage on complex-antenna test structures. In: Proceedings of the 4th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2001, 28-30 Nov 2001, Veldhoven, The Netherlands. pp. 220-223. Technology Foundation STW. ISBN 90-73461-29-4
Wang, Zhichun and Ackaert, J.G.G. and Salm, C. and Kuper, F.G. (2001) Plasma process-induced latent damage on gate oxide - demonstrated by single-layer and multi-layer antenna structures. In: 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits, 9-13 Jul 2001, Singapore, Thailand. pp. 220-223. IEEE Computer Society. ISBN 0-7803-6675-1
Wang, Zhichun and Scarpa, A. and Salm, C. and Kuper, F.G. (2001) Relation between plasma process-induced oxide failure fraction and antenna ratio. In: 6th International Symposium on Plasma Process-Induced Damage, 13-15 May 2001, Monterey, California, USA. pp. 16-19. IEEE Computer Society. ISBN 0-9651577-5-X

2000

Scarpa, A. and Tao, G. and Kuper, F.G. (2000) Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry. In: Proceedings of the 41st Annual IEEE International International Reliability Physics Symposium, IRPS 2003, 30 March - 4 April 2003, Dallas, Texas, USA. pp. 602-603. IEEE Computer Society. ISBN 0780376498