EEMCS

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Fast thermal cycling-enhanced electromigration in power metallization. IEEE Transactions on Device and Materials Reliability, 4 (2). pp. 246-255. ISSN 1530-4388 *** ISI Impact 1,483 ***

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of thermal gradients on the electromigration lifetime in power electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 Apr 2004, Phoenix, Arizona, USA. pp. 619-620. IEEE Computer Society. ISSN 1082-7285 ISBN 078038315X

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) Electrothermomigration-induced failure in power IC metallization. In: Proceedings of the 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands. pp. 622-630. Technology Foundation STW. ISBN 90-73461-39-1

Nguyen, Van Hieu and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) A reliability model for interlayer dielectric cracking during fast thermal cycling. In: Advanced Metallization Conference (AMC 2003), 21-23 Oct 2003, Montreal, Canada. pp. 295-299. Materials Research Society. ISBN 1558997571

Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling and electromigration induced thin film cracking multilevel interconnection: experiments and modeling. Microelectronics Reliability, 42 (9-11). pp. 1415-1420. ISSN 0026-2714 *** ISI Impact 1,066 ***

Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands. pp. 69-74. Technology Foundation STW. ISBN 90-73461-33-2

Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Test chip for detecting thin film cracking induced by fast temperature cycling and electromigration in multilevel interconnect systems. In: 9th International Symposium on Physics and Failure Analysis 2002, 8-12 Jul 2002, Singapore, Thailand. pp. 135-139. IEEE Computer Society. ISBN 0780374169

Nguyen, Van Hieu and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2001) Fast thermal cycling stress and degredation in multilayer interconnects. In: Proceedings of 4th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2001, 28-30 Nov 2001, Veldhoven, The Netherlands. pp. 136-140. Technology Foundation STW. ISBN 90-73461-29-4