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27122 Thermal issues in test: An overview of the significant aspects and industrial practice
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Alt, J. and Bernardi, P. and Bosio, A. and Cantoro, R. and Kerkhoff, H.G. and Leininger, A and Molzer, W. and Motta, A. and Pacha, C. and Pagani, A and Rohani, A. and Strasser, S. (2016) Thermal issues in test: An overview of the significant aspects and industrial practice. (Invited) In: IEEE 34th VLSI Test Symposium (VTS 2016), 25-27 Apr 2016, Las Vegas, NV, USA. pp. 1-4. IEEE. ISBN 978-1-4673-8454-4

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Official URL: http://dx.doi.org/10.1109/VTS.2016.7477278

Abstract

Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.

Item Type:Conference or Workshop Paper (Full Paper, Invited/Keynote Talk)
Research Group:EWI-CAES: Computer Architecture for Embedded Systems
Research Program:CTIT-General
Research Project:BASTION: On Board and SoC Test Instrumentation for Ageing and No-Failures Found phenomena
ID Code:27122
Status:Published
Deposited On:10 September 2016
Refereed:No
International:Yes
More Information:statistics

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